Soft, thixotropic, solvent free, epoxy paste, formulated to cure at room temperature and produce a high strength structural adhesive for bonding of metals, particularly aluminium and steel.
Formulated to overcome the problem of peeling failure in a metal-resin interface.
High chemical resistance, high compressive & tensile strengths, and also has excellent adhesion to all normal substrates.
Mix Ratio 1 part hardener to 1 part resin by weight or volume.
